Influence of Surfactants on Copper-CNTs Electrodeposition

Iryna Roslyk1, Ganna Stovpchenko2, Galyna Galchenko1
Affiliation: 
1 National Metallurgical Academy of Ukraine, 4, Gagarina Ave., 49600 Dnipro, Ukraine 2 Paton Electric Welding Institute of NAS of Ukraine, 11, K.Malevych St., 03150 Kyiv, Ukraine roslyk67@gmail.com
DOI: 
https://doi.org/10.23939/chcht15.01.125
AttachmentSize
PDF icon full_text.pdf2.59 MB
Abstract: 
Influence of different types of surfactants on electrodeposition of copper- and carbon-bearing (graphite, carbon nanotubes (CNTs)) composite powder has been experimentally investigated. The size of powder particles decreased, and corrosion resistance increased when surfactants were added. Addition of cationic surfactant CTAB to the electrolyte with simultaneous ultrasonic treatment for CNTs dispersion gives maximum effect.
References: 

[1] Pavlenko V., Yas D.: J. Powder Metall. Met. Ceram., 1976, 15, 89. https://doi.org/10.1007/BF00793555
[2] Uk P-H., Chung T-J., Lee H.: J. Ceram. Process. Res., 2017, 18, 440.
[3] Chu Y., Yu G., Hu B. et al.: Adv. Powder Technol., 2014, 25, 477. https://doi.org/10.1016/j.apt.2013.07.003
[4] Chen L., Yu G., Chu Y. et al.: Adv. Powder Technol., 2013, 24, 281. https://doi.org/10.1016/j.apt.2012.07.003
[5] Ajayan P., Schadler L., Braun P. (Eds.): Nanocomposite Science and Technology. Wiley-VCH Verlag GmbH, Weinheim 2003. https://doi.org/10.1002/3527602127
[6] Toth G., Maklin J., Halonen N. et al.: Adv. Mater., 2009, 21, 2054. https://doi.org/10.1002/adma.200802200
[7] Berber S., Kwon Y., Tomanek D.: Phys. Rev. Lett., 2000, 84, 4613. https://doi.org/10.1103/PhysRevLett.84.4613
[8] Jayathilaka W., Chinnappan A., Ramakrishna S.: J. Mater. Chem., 2017, C5, 9209. https://doi.org/10.1039/C7TC02965A
[9] Jiang L., Gao L., Sun J.: J. Colloid Interf. Sci., 2003, 260, 89. https://doi.org/10.1016/S0021-9797(02)00176-5
[10] Moore V., Strano M., Haroz E. et al.: Nano Leters, 2003, 3, 1379. https://doi.org/10.1021/nl034524j
[11] Rastogi R., Kaushal R., Tripathi S. et al.: J. Colloid Interf. Sci., 2008, 328, 421. https://doi.org/10.1016/j.jcis.2008.09.015
[12] Strano M., Moore V., Miller M. et al.: J. Nanosci. Nanotechnol., 2003, 3, 81. https://doi.org/10.1166/jnn.2003.194
[13] Vaisman L., Wagner H., Marom G.: Adv. Colloid Interf. Sci., 2006, 128-130, 37. https://doi.org/10.1016/j.cis.2006.11.007
[14] Schneider M., Weiser M., Dorfler S. et al.: Surg. Eng., 2012, 28, 34. https://doi.org/10.1179/1743294411Y.0000000095
[15] Arai S., Saito T., Endo M.: J. Electrochem. Soc., 2010, 157, D147. https://doi.org/10.1149/1.3280034
[16] Arai S., Suwa Y., Endo M.: J. Electrochem. Soc., 2011, 158, D49. https://doi.org/10.1149/1.3518414
[17] Ning D., Zhang A., Wu H.: Materials (Basel), 2019, 12, E392. https://doi.org/10.3390/ma12030392
[18] An Z., Toda M., Ono T.: 2016 IEEE 29th Int. Conf. on Micro Electro Mechanical Systems (MEMS). 24-28 Jan. 2016, Shanghai, China. https://doi.org/10.1109/MEMSYS.2016.7421678
[19] Guo H., Zhu H., Lin H., Zhang J.: Colloid Polym. Sci., 2008, 286, 587. https://doi.org/10.1007/ s00396-007-1828-0
[20] Zheng L., Sun J., Chen Q.: Micro Nano Lett., 2017,12, 722. https://doi.org/10.1049/mnl.2017.0317
[21] Arai S., Endo M.: Electrochem. Commun., 2003, 5, 797. https://doi.org/10.1016/j.elecom.2003.08.002
[22] Tihomirov V.: Peny. Teoriya i Praktika ih Polucheniya i Razrusheniya. Khimia, Moskva 1983.