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Application of Response Surface Method to Copper Cementation by Metallic Aluminum Particles

Nizamettin Demirkɪran1, G. Deniz Turhan Özdemir1, Merve Dardağan1
Affiliation: 
1 Department of Chemical Engineering, Faculty of Engineering, İnönü University, Malatya, 44280, Turkey nizamettin.demirkiran@inonu.edu.tr
DOI: 
https://doi.org/10.23939/chcht14.04.590
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Abstract: 
In the present study, the interactive effects of the process variables containing copper concentration, temperature, and time on the efficiency of copper cementation by metallic aluminum particles were examined by using response surface methodology (RSM). It was observed that the efficiency of cementation increased with an increase in the initial concentration of copper, temperature and time. The multiple regression analysis to the experimental data was applied to see the interactive effects of process variables. The second-order polynomial equation was obtained. The optimal values were found to be 0.075 mol/l, 303 K, and 90 min to maximize the amount of the deposited copper.
References: 

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